Semiconductor devices

From wafer metrology to printed circuit board inspection




    Semiconductor device inspection
  • Full 3D profile of PCB
  • 3D microdefects
  • Surface morphology
  • 1 micrometer resolution
  • Fast & automated scanning
  • User-friendly measurement and analysis
  • Automated detection of 3D microdefects
  • Automated inspection report generation
  • Export your data and inspection reports

PCB inspection with OptoComb 3D scanners by XTIA

PCB inspection
With their 1 μm resolution and 500 kHz acquisition speed, OptoComb 3D scanners go beyond the limits of conventional 2D inspection methods. They can measure in seconds the full 3D profile of printed circuit boards, including the smallest and most complex 3D features. Based on the high-accuracy 3D data of OptoComb, the automated inspection solutions offered by XTIA provide an instant assessment of the PCB dimensions and the 3D positioning of surface-mount devices. In addition, it also allows for the automated recognition of 3D microdefects such as scratches and particles.



Metallic and non-metallic components
As opposed to alternative optical methods, the interferential detection scheme of XTIA’s OptoComb sensors prevents the system from being affected by the ambient light. It makes OptoComb sensors ideal for use on the manufacturing floor in any light environment. It also allows for the measurement of both shiny and matt surfaces in the exact same conditions: metallic components (wiring, soldering) and non-metallic components can thus be fully scanned all at once.

Board inspection



Wafer metrology with OptoComb 3D scanners: GaN-on-Si surface metrology

Wafer metrology
Even semi-transparent objects such as semiconductor wafers can be measured with OptoComb 3D scanners. You can get insight into the morphology of the top wafer surface with a 1 μm resolution, extract its roughness or detect the presence of 3D microdefects. You can even measure the large curvature radius often encountered in hetero-epitaxial wafers.



Interested in a demonstration or a free test measurement of your sample? Contact us!



Semiconductor devices

From wafer metrology to PCB inspection




    Visual inspection of 3D microdefects
  • Full 3D profile of PCB
  • 3D microdefects
  • Surface morphology
  • 1 micrometer resolution
  • Fast & automated scanning
  • User-friendly measurement and analysis
  • Automated detection of 3D microdefects
  • Automated inspection report generation
  • Export your data and inspection reports


PCB inspection with OptoComb 3D scanners by XTIA

PCB inspection
With their 1 μm resolution and 500 kHz acquisition speed, OptoComb 3D scanners go beyond the limits of conventional 2D inspection methods. They can measure in seconds the full 3D profile of printed circuit boards, including the smallest and most complex 3D features. Based on the high-accuracy 3D data of OptoComb, the automated inspection solutions offered by XTIA provide an instant assessment of the PCB dimensions and the 3D positioning of surface-mount devices. In addition, it also allows for the automated recognition of 3D microdefects such as scratches and particles.




Board inspection

Metallic and non-metallic components
As opposed to alternative optical methods, the interferential detection scheme of XTIA’s OptoComb sensors prevents the system from being affected by the ambient light. It makes OptoComb sensors ideal for use on the manufacturing floor in any light environment. It also allows for the measurement of both shiny and matt surfaces in the exact same conditions: metallic components (wiring, soldering) and non-metallic components can thus be fully scanned all at once.




Wafer metrology with OptoComb 3D scanners: GaN-on-Si surface metrology

Wafer metrology
Even semi-transparent objects such as semiconductor wafers can be measured with OptoComb 3D scanners. You can get insight into the morphology of the top wafer surface with a 1 μm resolution, extract its roughness or detect the presence of 3D microdefects. You can even measure the large curvature radius often encountered in hetero-epitaxial wafers.




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